Advanced Microelectronics Manufacturing

FCT_Factory

Solutions for All Markets

inTFlex has new, fast, and accurate SMT equipment with the capability to execute complex assemblies. With Flip Chip, Die Bond, and Wire Bond assembly expertise we can support microelectronics across all markets.

Versatile Flex Designs

We also specialize in advanced flex designs, including complex multi-layer flex and rigid flex boards for high-density and versatile applications.

flat-flex

Download our Design Guide, which includes
Product Design Information, Quoting and Shipping/Packaging Options

Request a Quote

Our team is ready to connect and discuss your needs, no matter the application.
Request a quote today to share your ideas and
take the first step toward bringing your project to life.