Flexible Circuit Technologies:
Audio Flexible Circuit Solutions
The quality of your interconnects can make all the difference—affecting signal integrity, noise performance, and the overall user experience of your device.
As designs become smaller and more complex, Ultra High Density Interconnect (UHDI) technology is setting a new standard. While both HDI and UHDI support high connection density, UHDI takes it further—delivering finer traces, tighter spacing, and smaller micro vias for greater functionality in a smaller footprint.
Our interconnect solutions deliver high-fidelity signal transmission, compact, lightweight designs, and robust connectivity with built-in EMI shielding for superior performance.
Why Flex Circuits for AR/VR?
Seeing The Next Solutions
Flexible circuits are helping drive the next generation of AR/VR by delivering lighter, more reliable interconnect solutions. Replacing traditional wire harnesses with flexible circuits can reduce system weight by up to 70%, improve reliability by eliminating connectors and wiring failures, and create more compact designs. The result is longer flight times, increased performance, and greater durability for demanding industries and applications.
Enabling Innovation Across AR/VR Markets
Our interconnect solutions deliver high-fidelity signal transmission, compact, lightweight designs, and robust connectivity with built-in EMI shielding for superior performance.
Tech Specs
| Applications | AR/VR |
| Layers | 6-10L |
| Layer-to-Layer Registration | 75um |
| Min. Line Width & Spacing | 0.05/0.06mm |
| Feature | Air-gap |
Powering Critical AR/VR Applications
- SMART Tech
- Flight controllers
- Gaming
- Smart Glass
- Cameras
- Motor controllers
- GPS and more
Why Flex Circuits for Audio?
Hearing The Next Solutions
Flexible circuits are helping drive the next generation of audio solutions by delivering lighter, more reliable interconnect solutions. Replacing traditional wire harnesses with flexible circuits can reduce system weight by up to 70%, improve reliability by eliminating connectors and wiring failures, and create more compact designs. The result is longer flight times, increased performance, and greater durability for demanding industries and applications.
Enabling Innovation Across Audio Markets
Our interconnect solutions deliver high-fidelity signal transmission, compact, lightweight designs, and robust connectivity with built-in EMI shielding for superior performance.
Tech Specs
| Applications | Audio |
| Layers | 4-6L |
| Blind Vias | 0.05mm |
| Min. Line Width & Spacing | 0.045/0.1mm |
| Feature | Set warping ,0.4mm, Soldermask Consistency, HDI any layer |
Powering Critical Audio Applications
- SMART Tech
- Speakers
- Wireless Headphones
- Wireless Microphones
- Antennas
- Remotes
- Receivers/Amps
