ENDOSCOPE FLEXIBLE CIRCUITS
Enhancing endoscope performance with flexible circuits
FCT is partnering with leading medical device manufacturers to integrate endoscope cameras and LEDs directly onto extended-length flexible circuits. Leveraging our capability to build flex circuits up to 1.45 meters and beyond, we provide continuous signal paths from the proximal handle to the distal tip of endoscope-based devices—eliminating the need for multiple interconnects and improving overall system reliability.
FEATURES
Faster terminations and fewer interconnects simplify catheter assembly and routing, streamlining production and improving overall efficiency.
Fewer connections minimize potential failure points, while reduced rework and improved consistency deliver reliable performance in demanding, dynamic flexing applications.
Custom designs minimize width and stack-up thickness, achieving a smaller cross-sectional area than conventional wire harnesses for improved space efficiency.
Precision component mounting down to 01005 size, fine-line capability to 50 µm (0.002”) trace width and spacing, and impedance controlled designs ensure optimal performance and high-speed signal integrity for advanced electronic applications.
ENDOSCOPE SPECIFICATIONS
| ITEMS | MASS PRODUCTION |
|---|---|
| Layer | 1-6L |
| Thickness | Multi-layer board according to customer requirements |
| Single sided board: 0.065mm MIN | |
| Double-sided board: 0.125mm MIN | |
| Outline | Length: single/double/multi-layer: 1.45m MAX * |
| Width: single/double/multi-layer: 0.5mm - 0.8mm MIN * | |
| Multi-layer: 1.0mm MIN * | |
| *The data obtained from the average calculation according to the wiring of the product | |
| Options | Shield Film: (thickness: 16um, 20um) |
| FR4 (0.1-0.5mm) | |
| PI stiffener (0.075-0.225mm) | |
| Metallic stiffener (0.1-0.3mm) | |
| Min. Conductor Width & Spacing | Single and double sided circuit: 0.05mm |
| Multi-layered circuit: 0.075mm | |
| Alignment Tolerance Between Layers | 0.05mm |
| Conductor To Outline | Single and double sided circuit: >0.10mm |
| Multi-layer circuit: >0.15mm | |
| PAD To Outline | 0.2mm MIN |
| Min. Hole Size | Laser drill: Ø0.05mm |
| Mechanical drill PTH: Ø0.1mm | |
| Copper Plating Thickness | 10-15um (hole) |
| Min. Coverlay Openings | 0.50mm |
| Min. Coverlay Web | 0.30mm |
| Min. Solder Mask Opening | 0.20-0.30mm |
| Min. Solder Mask Web | 0.10mm |
| Max. Panel Size | ≤250*1500mm (single/double/multi-layer) |
| Final Finish | ENIG (NI:2-6um AU:0.05-0.09um) |
| Electroplated hard gold (NI:2-6um AU:0.1-1.0um) | |
| Electroplated soft gold (NI:2-6um AU:0.1-1.0um) | |
| Trim Method | Laser (outline<1mm) |
| Tooling (Outline>1mm)-- tooling costs ≥ $4k | |
| Impedence Requirement | Differential impedance: 100ohms+/-10% |
RESOURCES
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