Flexible Circuit Technologies

Surface Mount Components – Passives, I/C’s, LEDs and connectors are examples of surface mount technology (SMT). SMT is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed or flexible circuits.

Flip Chip on Flex – A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done through metal bumps of solder, copper or nickel/gold.

Through Hole Components – Often accomplished through hand assembly, through hole assembly is the process of fitting components with wire leads into holes in the circuit and then soldering them into place.

Ultrasonic Welding – Ultrasonic welding is a technique utilizing high frequency ultrasonic acoustic vibrations to weld objects together. This type of welding is used to build assemblies that are too small, too complex, or too delicate for more common welding techniques. With ultrasonic welding, there are no connective bolts, nails, soldering materials or adhesives necessary to bind the materials together.

Printed Circuit with Wire Harness
and Component Assembly

Wire Harnesses – If your design calls for a wire harness, Flexible Circuit can help.  This could entail cutting, stripping or terminating, just to name a few.

In Circuit Testing- At your request, we can design a fixture that will test various components of your circuit subassembly

X-Ray Inspection – As circuits continue to get smaller and smaller, the need for X-ray inspection is growing in importance.  Standard surface mount or through hole solder joints can be inspected with x –rays to show voiding at the joint interface which, if present, may compromise the final assembly.

Packaging Trays – finished assemblies can be shipped in ESD protective packaging units

Pressure Sensitive Adhesives (PSAs) – PSAs with a release liner are used in applications where a portion(s) of the circuit needs to be secured to a specific location within the final product. During assembly, the release liner is peeled away and the exposed adhesive allows the assembler to press the circuit into place and keep it there.